Lihlahisoa
4 layer FPC e nang le FR4 stiffener tsamaisong ea module ea 4G
| Mekhahlelo | Mekhahlelo e 4 e kobehang |
| Botenya ba boto | 0.2 limilimithara |
| Lintho tse bonahalang | Polymide |
| Botenya ba koporo | 1 OZ(35um) |
| Surface Finish | ENIG Au Botenya 1um;Ni Botenya 3um |
| Min Hole(mm) | 0.23 limilimithara |
| Min Line Width(mm) | 0.15 limilimithara |
| Min Line Space(mm) | 0.15 limilimithara |
| Mask ea solder | Botala |
| 'Mala oa Legend | Bosoeu |
| Ts'ebetso ea mechine | V-scoring, CNC Milling(routing) |
| Ho paka | Mokotla oa anti-static |
| Teko ea E | Sesebelisoa se fofang kapa Tokiso |
| Tekanyetso ea ho amohela | IPC-A-600H Sehlopha sa 2 |
| Kopo | Lisebelisoa tsa elektronike tsa likoloi |
Selelekela
A flex PCB ke mofuta o ikhethang oa PCB oo u ka o inamelang ka sebopeho se lakatsehang.Hangata li sebelisoa bakeng sa ts'ebetso e phahameng ea density le mocheso o phahameng.
Ka lebaka la ho hanyetsa mocheso o babatsehang, moralo o feto-fetohang o loketse lisebelisoa tsa ho kenya solder.Filimi ea polyester e pepeneneng e sebelisitsoeng ho aha meralo ea flex e sebetsa e le thepa ea substrate.
O ka fetola botenya ba koporo ho tloha ho 0.0001 ″ ho isa ho 0.010 ″, ha thepa ea dielectric e ka ba lipakeng tsa 0.0005 ″ le 0.010 ″ botenya.Lihokelo tse fokolang ka moralo o tenyetsehang.
Ka hona, ho na le likhokahano tse fokolang tse rekisoang.Ho feta moo, lipotoloho tsena li nka 10% feela ea sebaka se thata sa boto
ka lebaka la ho kobeha ha bona habonolo.
Lintho tse bonahalang
Lisebelisoa tse tenyetsehang le tse tsamaeang li sebelisoa ho etsa li-PCB tse tenyetsehang.Ho feto-fetoha ha eona ho e lumella hore e fetohe kapa e sisinyehe ntle le tšenyo e ke keng ea etsolloa ho likarolo tsa eona kapa likhokahano.
Karolo e 'ngoe le e' ngoe ea flex PCB e tlameha ho sebetsa 'moho hore e sebetse hantle.U tla hloka lisebelisoa tse fapaneng ho kopanya boto ea flex.
Koahela Layer Substrate
Conductor carrier le insulating medium e etsa qeto ea mosebetsi oa substrate le filimi.Ho feta moo, substrate e tlameha ho khona ho kobeha le ho kobeha.
Lipampiri tsa polyimide le polyester hangata li sebelisoa lipotolohong tse tenyetsehang.Tsena ke tse 'maloa feela tsa lifilimi tsa polymer tseo u ka li fumanang, empa ho na le tse ling tse ngata tseo u ka khethang ho tsona.
Ke khetho e ntle ka lebaka la theko e tlase le substrate ea boleng bo holimo.
PI polyimide ke thepa e sebelisoang haholo ke bahlahisi.Mofuta ona oa resin ea thermostatic o khona ho mamella mocheso o feteletseng.Kahoo ho qhibiliha ha se bothata.Ka mor'a polymerization ea mocheso, e ntse e boloka elasticity le ho feto-fetoha ha eona.Ho phaella ho sena, e na le thepa e babatsehang ea motlakase.
Lisebelisoa tsa Mokhanni
U tlameha ho khetha ntho ea conductor e fetisang matla ka katleho.Hoo e ka bang lipotoloho tsohle tse thibelang ho phatloha li sebelisa koporo e le mokhanni oa mantlha.
Ntle le ho ba sekontiri se setle haholo, koporo e boetse e batla e fumaneha habonolo.Ha ho bapisoa le theko ea lisebelisoa tse ling tsa li-conductor, koporo ke theko e tlaase.Conductivity ha ea lekana ho qhala mocheso ka katleho;hape e tlameha ho ba conductor e ntle ea mocheso.Li-circuits tse feto-fetohang li ka etsoa ka lisebelisoa tse fokotsang mocheso oo li o hlahisang.
Likhomaretsi
Ho na le sekhomaretsi lipakeng tsa letlapa la polyimide le koporo ho boto efe kapa efe ea potoloho ea flex.Epoxy le acrylic ke likhomaretsi tse peli tse ka sehloohong tseo u ka li sebelisang.
Likhomaretsi tse matla lia hlokahala ho sebetsana le mocheso o phahameng o hlahisoang ke koporo.
