Ho ANKE PCB, lits'ebeletso tse tloaelehileng tsa PCB li bua ka lits'ebeletso tsa tlhahiso ea boto e hatisitsoeng ka botlalo.Ka lilemo tse fetang 10 Boiphihlelo ba ho etsa PCBs, re sebelitse likete tsa merero ea PCB e koahelang hoo e batlang e le mofuta o mong le o mong oa thepa ea substrate ho kenyelletsa FR4, Aluminium, Rogers le tse ling.Leqephe lena le bua feela ka li-PCB tse tloaelehileng tsa FR4.Bakeng sa li-PCB tse nang le likaroloana tse khethehileng tsa tekheniki, ka kopo sheba maqephe a tepo a tsamaisanang bakeng sa tlhahisoleseling kapa u ikutloe u lokolohile ho re romella mangolo hoinfo@anke-pcb.com.
Ho fapana le disampole pcb, PCB e tloaelehileng e na le mamello e thata ea tlhahiso le boleng bo tsitsitseng ba tlhahiso.
Litšebeletso tse tloaelehileng tsa PCB lia khothaletsoa ha moralo oa hau o se o loketse ho fetoha ho tloha ho mohlala ho ea ho tlhahiso.Re ka hlahisa li-PCB tsa boleng bo holimo tse fihlang ho limilione tse 10 ka matsatsi a 2 feela.Ho fa projeke ea hau tšebetso e lakatsehang le menyetla e mengata, re fana ka likarolo tse tsoetseng pele bakeng sa lits'ebeletso tse tloaelehileng tsa PCB.Bokhoni bo akaretsang bo bontšoa ka tsela e latelang:
Bokhoni bo Akaretsang
| Sebopeho | Bokgoni |
| Kereiti ya boleng | IPC e tloaelehileng ea 2 |
| Palo ea Meralo | 1 -42 methati |
| Order Quantity | 1pc - 10,000,000 likhomphutha |
| Lead time | 1 letsatsi - libeke tse 5 (Tšebeletso e potlakileng) |
| Lintho tse bonahalang | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg180°C,FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Boto ea Boto | 610*1100mm |
| Mamello ea boholo ba boto | ± 0.1mm - ± 0.3mm |
| Botenya ba Boto | 0.2-0.65mm |
| Mamello ea Botenya ba Boto | ±0.1mm - ±10% |
| Boima ba Koporo | 1-6OZ |
| Lera le ka hare Boima ba Koporo | 1-4OZ |
| Mamello ea Botenya ba Koporo | +0μlimithara +20μm |
| Min Tracing/Spacing | 3mil/3mil |
| Mahlakore a Mask a Solder | Joalo ka faele |
| Mobala oa Mask oa Solder | Botala, Bosoeu, Botala, Botsho, Bokhubelu, Bosehla |
| Silkscreen Mahlakoreng | Joalo ka faele |
| Silkscreen Color | Bosoeu, Boputsoa, Botsho, Bokhubelu, Bosehla |
| Surface Finish | HASL - Boemo ba Solder ea Moea o Chesang Etellang mahala HASL - RoHS ENIG - Nickle e se nang Motlakase / Khauta ea ho qoelisoa - RoHS ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS Silivera ea ho qoelisoa - RoHS Ho qoelisoa Tin - RoHS OSP -Organic Solderability Preservatives - RoHS Khetho ea Khauta ea Plating, botenya ba Khauta ho fihla ho 3um(120u”) |
| Min Annular Ring | 3 mil |
| Min Drilling Hole Diameter | 6mil, 4mil-laser ea ho cheka |
| Min Width of Cutout (NPTH) | Min Width of Cutout (NPTH) |
| Mamello ea boholo ba lesoba la NPTH | ±.002" (±0.05mm) |
| Min Width of Slot Hole (PTH) | 0.6 limilimithara |
| PTH Hole Size Mamello | ±.003" (±0.08mm) - ± 4mil |
| Botenya ba Bokaholimo/Lesoba | 20μm - 30μm |
| Mamello ea SM (LPI) | 0.003" (0.075mm) |
| Aspect ratio | 1.10 (boholo ba lesoba: botenya ba boto) |
| Teko | 10V - 250V, probe e fofang kapa sesebelisoa sa liteko |
| Mamello ea impedance | ±5% - ±10% |
| Phatlalatso ea SMD | 0.2mm(8mil) |
| Tlhaloso ea BGA | 0.2mm(8mil) |
| Chamfer ea Menoana ea Khauta | 20, 30, 45, 60 |
| Mekhoa e Meng | Menoana ea khauta Likoti tse Foufetseng le tse Patiloeng maske ea solder e peelable plating ea moeli Mask ea Carbon Theipi ea Kapton Mokoti oa sekoahelo / counterbore lesoba Mokoti o sehiloeng (half-cut) /half-cut/ Lesoba le nang le leqhoele Tobetsa sekoti se lekanang Ka litente / tse koahetsoeng ka resin Ka ho kenngoa / ho tlatsitsoe ka resin Ka pad Teko ea Motlakase |
