Lihlahisoa
Artificial intelligence 8 layer pcb e nang le vais ho pad tech
| Mekhahlelo | 8 layers |
| Botenya ba boto | 1.60MM |
| Lintho tse bonahalang | FR4 tg170 |
| Botenya ba koporo | 1/1/1/1/1/1/1/1/1 OZ(35um) |
| Surface Finish | ENIG Au Botenya 0.05um;Ni Botenya 3um |
| Min Hole(mm) | 0.203mm e tletse resin |
| Min Line Width(mm) | 0.13 limilimithara |
| Min Line Space(mm) | 0.13 limilimithara |
| Mask ea solder | Botala |
| 'Mala oa Legend | Bosoeu |
| Ts'ebetso ea mechine | V-scoring, CNC Milling(routing) |
| Ho paka | Mokotla oa anti-static |
| Teko ea E | Sesebelisoa se fofang kapa Tokiso |
| Tekanyetso ea ho amohela | IPC-A-600H Sehlopha sa 2 |
| Kopo | Lisebelisoa tsa elektronike tsa likoloi |
Boitsebiso ba Sehlahisoa
Joaloka mofani oa mefuta e fapaneng ea theknoloji ea PCB, li-volumes, likhetho tsa nako ea ho etella pele, re na le khetho ea lisebelisoa tse tloaelehileng tseo ho tsona ho ka koaheloang ka mefuta e mengata ea mefuta e fapaneng ea mefuta ea PCB le tse lulang li fumaneha ka tlung.
Litlhokahalo tsa lisebelisoa tse ling kapa tse khethehileng le tsona li ka fihlelleha maemong a mangata, empa, ho latela litlhoko tse nepahetseng, ho ka hlokahala matsatsi a ka bang 10 ho reka thepa eo.
Ikopanye le rona 'me u buisane ka litlhoko tsa hau le e mong oa barekisi ba rona kapa sehlopha sa CAM.
Thepa e tloaelehileng e teng stock:
| Likaroloana | Botenya | Mamello | Mofuta oa weave |
| Mekhahlelo ea ka hare | 0,05 limilimithara | +/-10% | 106 |
| Mekhahlelo ea ka hare | 0.10 limilimithara | +/-10% | 2116 |
| Mekhahlelo ea ka hare | 0,13 limilimithara | +/-10% | 1504 |
| Mekhahlelo ea ka hare | 0,15 limilimithara | +/-10% | 1501 |
| Mekhahlelo ea ka hare | 0.20 limilimithara | +/-10% | 7628 |
| Mekhahlelo ea ka hare | 0,25 limilimithara | +/-10% | 2 x 1504 |
| Mekhahlelo ea ka hare | 0.30 limilimithara | +/-10% | 2 x 1501 |
| Mekhahlelo ea ka hare | 0.36 limilimithara | +/-10% | 2 x 7628 |
| Mekhahlelo ea ka hare | 0,41 limilimithara | +/-10% | 2 x 7628 |
| Mekhahlelo ea ka hare | 0,51 limilimithara | +/-10% | 3 x 7628/2116 |
| Mekhahlelo ea ka hare | 0,61 limilimithara | +/-10% | 3 x 7628 |
| Mekhahlelo ea ka hare | 0.71 limilimithara | +/-10% | 4 x 7628 |
| Mekhahlelo ea ka hare | 0,80 limilimithara | +/-10% | 4 x 7628/1080 |
| Mekhahlelo ea ka hare | 1,0 limilimithara | +/-10% | 5 x7628/2116 |
| Mekhahlelo ea ka hare | 1,2 limilimithara | +/-10% | 6 x7628/2116 |
| Mekhahlelo ea ka hare | 1,55 limilimithara | +/-10% | 8 x7628 |
| Prepregs | 0.058mm* | Ho itshetlehile ka sebopeho | 106 |
| Prepregs | 0.084mm* | Ho itshetlehile ka sebopeho | 1080 |
| Prepregs | 0.112mm* | Ho itshetlehile ka sebopeho | 2116 |
| Prepregs | 0.205mm* | Ho itshetlehile ka sebopeho | 7628 |
Cu botenya bakeng sa likarolo tse ka hare: Standard - 18µm le 35 µm,
ka kopo 70 µm, 105µm le 140µm
Mofuta oa lintho tse bonahalang: FR4
Tg: hoo e ka bang.150°C, 170°C, 180°C
εr ho 1 MHz: ≤5,4 (e tloaelehileng: 4,7) Tse ling li fumaneha ka kopo
Stackup
A standard 8 layer PCB stackup ke 8 PCB board.
E na le likarolo tsa mats'oao a kantle le a kahare, 'me e na le likarolo tse ngata tse ka thoko ho eona ho thibela matšoao a crosstalk.
Likarolo tsa 8 layer PCB stackup ke tse latelang:
·Sebapadi
·Silkscreenlayer
·Masklayer ea solder
·Seboholi sa lebelo le holimo
· Lera la lets'oao
·Powerlane
· Sekhahla sa fatše
Ho na le likarolo tse 7 tsa dielectric tse hokahanyang lifofane tse 'nè tsa fatše ho mekhahlelo e mene ea matšoao.
