| Order Quantity | ≥1PCS |
| Kereiti ya boleng | IPC-A-610 |
| Lead time | 48H bakeng sa ho akofisa; |
| matsatsi a 4-5 bakeng sa mohlala; | |
| Bongata bo bong fana ha u qotsa | |
| Boholo | 50 * 50mm-510 * 460mm |
| Mofuta oa Boto | E thatafetse |
| E tenyetsehang | |
| Regid-flexible | |
| Mokotla oa tšepe | |
| Min Package | 01005(0.4mm*0.2mm) |
| Mounting Ho Nepaha | ±0.035mm(±0.025mm)Cpk≥1.0 |
| Surface Finish | Keta / Etapele HASL MAHALA, khauta e qoelisoang, OSP, joalo-joalo |
| Mofuta oa Kopano | THD (sesebedisoa sa Thru-hole) / Tloaelehang |
| SMT (Theknoloji ea Surface-Mount) | |
| SMT & THD e tsoakane | |
| Kopano ea SMT e nang le mahlakore a mabeli le/kapa THD | |
| Ho fumana likarolo | Turnkey(Likarolo tsohle tse tsoang ho ANKE), turnkey e sa fellang, E rometsoe |
| Pakete ea BGA | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Sephutheloana sa likarolo | Reels, Theipi ea Seha, Tube, Terei, likarolo tse hlephileng |
| Kopano ea Cable | Lithapo tse tloahelehileng, likopano tsa lithapo, likhoele/marapo |
| Stencil | Stencil e nang le foreimi kapa ntle le eona |
| Etsa sebopeho sa faele | Gerber RS-274X, 274D, Eagle le AutoCAD's DXF, DWG |
| BOM (Bill of Materials) | |
| Khetha faele mme u behe (XYRS) | |
| Tlhahlobo ea Boleng | Tlhahlobo ea X-ray, |
| AOI (Automated Optical Inspector), | |
| Teko e sebetsang (li-module tsa liteko li hloka ho fanoa) | |
| Teko ea ho chesoa | |
| Bokhoni ba SMT | 3 Million-4 Million solder pad/letsatsi |
| Bokhoni ba DIP | 100 Thousand pin/letsatsi |
Nako ea poso: Sep-05-2022
