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PCB Fabrication Overview

Ho ANKE PCB, lits'ebeletso tse tloaelehileng tsa PCB li bua ka lits'ebeletso tsa tlhahiso ea boto e hatisitsoeng ka botlalo.Ka lilemo tse fetang 10 Boiphihlelo ba ho etsa PCBs, re sebelitse likete tsa merero ea PCB e koahelang hoo e batlang e le mofuta o mong le o mong oa thepa ea substrate ho kenyelletsa FR4, Aluminium, Rogers le tse ling.Leqephe lena le bua feela ka li-PCB tse tloaelehileng tsa FR4.Bakeng sa li-PCB tse nang le likaroloana tse khethehileng tsa tekheniki, ka kopo sheba maqephe a tepo a tsamaisanang bakeng sa tlhahisoleseling kapa u ikutloe u lokolohile ho re romella mangolo hoinfo@anke-pcb.com.

Ho fapana le disampole pcb, PCB e tloaelehileng e na le mamello e thata ea tlhahiso le boleng bo tsitsitseng ba tlhahiso.

Litšebeletso tse tloaelehileng tsa PCB lia khothaletsoa ha moralo oa hau o se o loketse ho fetoha ho tloha ho mohlala ho ea ho tlhahiso.Re ka hlahisa li-PCB tsa boleng bo holimo tse fihlang ho limilione tse 10 ka matsatsi a 2 feela.Ho fa projeke ea hau tšebetso e lakatsehang le menyetla e mengata, re fana ka likarolo tse tsoetseng pele bakeng sa lits'ebeletso tse tloaelehileng tsa PCB.Bokhoni bo akaretsang bo bontšoa ka tsela e latelang:

Bokhoni bo Akaretsang

Sebopeho

 Bokgoni

Kereiti ya boleng

IPC e tloaelehileng ea 2

Palo ea Meralo

1 -42 methati

Order Quantity

1pc - 10,000,000 likhomphutha

Lead time

1 letsatsi - libeke tse 5 (Tšebeletso e potlakileng)

Lintho tse bonahalang

FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg180°C,FR4-Halogen-free, FR4-Halogen-free & High-Tg

Boto ea Boto

610*1100mm

Mamello ea boholo ba boto

± 0.1mm - ± 0.3mm

Botenya ba Boto

0.2-0.65mm

Mamello ea Botenya ba Boto

±0.1mm - ±10%

Boima ba Koporo

1-6OZ

Lera le ka hare Boima ba Koporo

1-4OZ

Mamello ea Botenya ba Koporo

+0μlimithara +20μm

Min Tracing/Spacing

3mil/3mil

Mahlakore a Mask a Solder

Joalo ka faele

Mobala oa Mask oa Solder

Botala, Bosoeu, Botala, Botsho, Bokhubelu, Bosehla

Silkscreen Mahlakoreng

Joalo ka faele

Silkscreen Color

Bosoeu, Boputsoa, ​​​​Botsho, Bokhubelu, Bosehla

Surface Finish

HASL - Boemo ba Solder ea Moea o Chesang

Etellang mahala HASL - RoHS

ENIG - Nickle e se nang Motlakase / Khauta ea ho qoelisoa - RoHS

ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS

Silivera ea ho qoelisoa - RoHS

Ho qoelisoa Tin - RoHS

OSP -Organic Solderability Preservatives - RoHS

Khetho ea Khauta ea Plating, botenya ba Khauta ho fihla ho 3um(120u)

Min Annular Ring

3 mil

Min Drilling Hole Diameter

6mil, 4mil-laser ea ho cheka

Min Width of Cutout (NPTH)

Min Width of Cutout (NPTH)

Mamello ea boholo ba lesoba la NPTH

±.002" (±0.05mm)

Min Width of Slot Hole (PTH)

0.6 limilimithara

PTH Hole Size Mamello

±.003" (±0.08mm) - ± 4mil

Botenya ba Bokaholimo/Lesoba

20μm - 30μm

Mamello ea SM (LPI)

0.003" (0.075mm)

Aspect ratio

1.10 (boholo ba lesoba: botenya ba boto)

Teko

10V - 250V, probe e fofang kapa sesebelisoa sa liteko

Mamello ea impedance

±5% - ±10%

Phatlalatso ea SMD

0.2mm(8mil)

Tlhaloso ea BGA

0.2mm(8mil)

Chamfer ea Menoana ea Khauta

20, 30, 45, 60

Mekhoa e Meng

Menoana ea khauta

Likoti tse Foufetseng le tse Patiloeng

maske ea solder e peelable

plating ea moeli

Mask ea Carbon

Theipi ea Kapton

Mokoti oa sekoahelo / counterbore lesoba

Mokoti o sehiloeng (half-cut) /half-cut/ Lesoba le nang le leqhoele

Tobetsa sekoti se lekanang

Ka litente / tse koahetsoeng ka resin

Ka ho kenngoa / ho tlatsitsoe ka resin

Ka pad

Teko ea Motlakase