Lihlahisoa
4 layer pcb e nang le monoana oa khauta ho sistimi ea audio ea dijithale
| Mekhahlelo | 4 mealo |
| Botenya ba boto | 1.60MM |
| Lintho tse bonahalang | FR4 tg150 |
| Botenya ba koporo | 1 OZ(35um) |
| Surface Finish | ENIG Au Botenya 1um;Ni Botenya 3um |
| Min Hole(mm) | 0.203 limilimithara |
| Min Line Width(mm) | 0.15 limilimithara |
| Min Line Space(mm) | 0.15 limilimithara |
| Mask ea solder | Botala |
| 'Mala oa Legend | Bosoeu |
| Ts'ebetso ea mechine | V-scoring, CNC Milling(routing) |
| Ho paka | Mokotla oa anti-static |
| Teko ea E | Sesebelisoa se fofang kapa Tokiso |
| Tekanyetso ea ho amohela | IPC-A-600H Sehlopha sa 2 |
| Kopo | Lisebelisoa tsa elektronike tsa likoloi |
Boitsebiso ba Sehlahisoa
Joaloka mofani oa mefuta e fapaneng ea theknoloji ea PCB, li-volumes, likhetho tsa nako ea ho etella pele, re na le khetho ea lisebelisoa tse tloaelehileng tseo ho tsona ho ka koaheloang ka mefuta e mengata ea mefuta e fapaneng ea mefuta ea PCB le tse lulang li fumaneha ka tlung.
Litlhokahalo tsa lisebelisoa tse ling kapa tse khethehileng le tsona li ka fihlelleha maemong a mangata, empa, ho latela litlhoko tse nepahetseng, ho ka hlokahala matsatsi a ka bang 10 ho reka thepa eo.
Ikopanye le rona 'me u buisane ka litlhoko tsa hau le e mong oa barekisi ba rona kapa sehlopha sa CAM.
Thepa e tloaelehileng e teng stock:
| Likaroloana | Botenya | Mamello | Mofuta oa weave |
| Mekhahlelo ea ka hare | 0,05 limilimithara | +/-10% | 106 |
| Mekhahlelo ea ka hare | 0.10 limilimithara | +/-10% | 2116 |
| Mekhahlelo ea ka hare | 0,13 limilimithara | +/-10% | 1504 |
| Mekhahlelo ea ka hare | 0,15 limilimithara | +/-10% | 1501 |
| Mekhahlelo ea ka hare | 0.20 limilimithara | +/-10% | 7628 |
| Mekhahlelo ea ka hare | 0,25 limilimithara | +/-10% | 2 x 1504 |
| Mekhahlelo ea ka hare | 0.30 limilimithara | +/-10% | 2 x 1501 |
| Mekhahlelo ea ka hare | 0.36 limilimithara | +/-10% | 2 x 7628 |
| Mekhahlelo ea ka hare | 0,41 limilimithara | +/-10% | 2 x 7628 |
| Mekhahlelo ea ka hare | 0,51 limilimithara | +/-10% | 3 x 7628/2116 |
| Mekhahlelo ea ka hare | 0,61 limilimithara | +/-10% | 3 x 7628 |
| Mekhahlelo ea ka hare | 0.71 limilimithara | +/-10% | 4 x 7628 |
| Mekhahlelo ea ka hare | 0,80 limilimithara | +/-10% | 4 x 7628/1080 |
| Mekhahlelo ea ka hare | 1,0 limilimithara | +/-10% | 5 x7628/2116 |
| Mekhahlelo ea ka hare | 1,2 limilimithara | +/-10% | 6 x7628/2116 |
| Mekhahlelo ea ka hare | 1,55 limilimithara | +/-10% | 8 x7628 |
| Prepregs | 0.058mm* | Ho itshetlehile ka sebopeho | 106 |
| Prepregs | 0.084mm* | Ho itshetlehile ka sebopeho | 1080 |
| Prepregs | 0.112mm* | Ho itshetlehile ka sebopeho | 2116 |
| Prepregs | 0.205mm* | Ho itshetlehile ka sebopeho | 7628 |
Cu botenya bakeng sa likarolo tse ka hare: Standard - 18µm le 35 µm,
ka kopo 70 µm, 105µm le 140µm
Mofuta oa lintho tse bonahalang: FR4
Tg: hoo e ka bang.150°C, 170°C, 180°C
εr ho 1 MHz: ≤5,4 (e tloaelehileng: 4,7) Tse ling li fumaneha ka kopo
Stackup
The 4 layer printed circuitboard stackup e na le 3 ea mekhahlelo e le 'ngoe le mokato oa fatše o etsang hore e 4 ka kakaretso.
Likarolo tsena kaofela li sebelisetsoa ho tsamaisa matšoao.
Lilafi tse peli tsa pele tse ka hare li ka har'a mantlha 'me hangata li sebelisoa joalo ka liphasejene tsa motlakase kapa hangata li bitsoa ho tsamaisa mats'oao.
Ho bua habonolo feela "4-layer PCB stackup" e na le 2 ea singlea VCC le mokato oa fatše.
Lintlha tsa bohlokoa bakeng sa ho reka pcb
Boholo ba bareki ba fektheri ea elektroniki ba ferekantsoe ka theko ea li-PCB.esita le batho ba bang ba nang le phihlelo ea lilemo tse ngata ho PCB ea ho reka thepa ba ka 'na ba se ke ba utloisisa ka botlalo lebaka la pele.Ebile, theko ea PCB e entsoe ka lintlha tse latelang:
Pele, litheko li fapane ka lebaka la lisebelisoa tse fapaneng tse sebelisoang ho PCB.
Ho nka mohlala o tloaelehileng oa mekhahlelo e 'meli ea pcb e le mohlala, laminate e fapana ho tloha ho FR-4, CEM-3, joalo-joalo ka mekhahlelo ea botenya ho tloha ho 0.2mm ho ea ho 3.6mm.Botenya ba koporo bo fapana ho tloha ho 0.5Oz ho isa ho 6Oz, tseo kaofela li bakileng phapang e kholo ea theko.The soldermask enke theko e boetse e fapane ho tloha tloaelehileng thermosetting enke lintho tse bonahalang le photosensitive tala enke lintho tse bonahalang.
Ea bobeli, litheko li fapane ka lebaka la mekhoa e fapaneng ea tlhahiso.
Mekhoa e fapaneng ea tlhahiso e fella ka litšenyehelo tse fapaneng.Tse kang boto e entsoeng ka khauta le boto e entsoeng ka thini, sebōpeho sa ho tsamaisa le ho phunya, tšebeliso ea mela ea skrine ea silika le mela e omeletseng ea lifilimi e tla theha litšenyehelo tse fapaneng, tse hlahisang phapang ea theko.
