Lihlahisoa
Koporo base Metal konokono pcb bakeng sa ka ntle ho bontša tsamaiso
Ena ke 2 layermotheo oa koporoPCB bakeng sakgantshaindasteri.A Metal Core Printed Circuit Board (MCPCB), kapa PCB e futhumatsang, ke mofuta oa PCB o nang le thepa ea tšepe e le motheo oa karolo ea mocheso oa boto.
UL e netefalitsoengLisebelisoa tsa motheo tsa koporo, 3/3OZ(105um) botenya ba koporo, ENIG Au Botenya0.8um;Ni Botenya 3um.Bonyane ka 0.203 mme tletseng resin.
| Mekhahlelo | 2mealo |
| Botenya ba boto | 3.2MM |
| Lintho tse bonahalang | Motheo oa koporo |
| Botenya ba koporo | 3/3OZ(105um) |
| Surface Finish | ENIG Au Botenya0.8um;Ni Botenya 3um |
| Min Hole(mm) | 0.3 limilimithara |
| Min Line Width(mm) | 0.2mm |
| Min Line Space(mm) | 0.2mm |
| Mask ea solder | Ntsho |
| 'Mala oa Legend | Bosoeu |
| Ts'ebetso ea mechine | V-scoring, CNC Milling(routing) |
| Ho paka | Mokotla oa anti-static |
| Teko ea E | Sesebelisoa se fofang kapa Tokiso |
| Tekanyetso ea ho amohela | IPC-A-600H Sehlopha sa 2 |
| Kopo | Lisebelisoa tsa elektronike tsa likoloi |
Metal Core PCB kapa MCPCB
Metal Core PCB (MCPCB) e tsejoa e le Metal Backplane PCB kapa Thermal PCB.Mofuta ona oa PCB o sebelisa thepa ea tšepe ho e-na le FR4 e tloaelehileng bakeng sa motheo oa eona, karolo ea boto ea mocheso.
As ea tsebahalamocheso o hlahisoa ka boto ka lebaka le itseng Likarolo tsa elektroniki nakong ea ts'ebetso.Metal e fetisetsa mocheso ho tloha boto ea potoloho ebe e e khutlisetsa ho Metal core kapa tšepe ea mocheso oa tšepe e tšehetsang le ho boloka lintho tsa bohlokoa Element.
Ho PCB ea multilayer u tla fumana palo e ts'oanang ea likarolo tse ajoang lehlakoreng la mantlha la tšepe.Ka mohlala, ha u sheba Holima PCB ea 12, u tla fumana likarolo tse tšeletseng ka holimo le tse tšeletseng ka tlase, bohareng ke motheo oa tšepe.
MCPCB kapa Metal Core PCB E boetse e tsejoa e le ICPB kapa Insulated Metal PCB, IMS kapa Insulated Metal Substrates, Metal Clad PCBs le Thermal Clad PCBs.
Fkapa uena Bakeng sa kutloisiso e betere re tla sebelisa poleloana ea tšepe ea mantlha PCB ho pholletsa le sengoloa sena.
Sebopeho sa mantlha sa PCB ea mantlha ea tšepe se kenyelletsa tse latelang:
Lera la Koporo - 1oz.to 6oz.(e tloaelehileng haholo ke 1oz kapa 2oz)
lera la potoloho
Lera la dielectric
Maske a solder
Sekepe sa mocheso kapa sink ea mocheso (metal core layer)
Molemo bakeng sa MCPCB
Thermal Conductivity
CEM3 kapa FR4 ha li ntle ho tsamaisa mocheso.haeba ho chesa
Li-substrates tse sebelisoang ho PCB li na le conductivity e fokolang 'me li ka senya likarolo tsa boto ea PCB.Ke nakong eo li-PCB tsa mantlha tsa tšepe li tlang ho sebetsa.
MCPCB e na le conductivity e ntle ea mocheso ho sireletsa likarolo ho senya.
Hja dissipation
E fana ka bokhoni bo babatsehang ba ho pholisa.Metal core PCBs e ka qhala mocheso ho tsoa ho IC hantle haholo.Thermally conductive layer e ntan'o fetisetsa mocheso ho substrate ea tšepe.
Sekala botsitso
E fana ka e phahameng dimensional botsitso ho feta mefuta e meng ea PCBs.Ka mor'a hore mocheso o fetoloe ho tloha ho likhato tse 30 tsa Celsius ho ea ho 140-150 likhato tsa Celsius, phetoho ea boholo ba motheo oa tšepe ea aluminium ke 2.5 ~ 3%.
Rfokotsa ho sotha
Kaha li-PCB tsa mantlha tsa tšepe li na le phepelo e ntle ea mocheso le conductivity ea mocheso, ha li na monyetla oa ho fetoha ka lebaka la mocheso o kentsoeng.Ka lebaka la tšobotsi ena ea mantlha ea tšepe, li-PCB ke khetho ea pele bakeng sa lits'ebetso tsa phepelo ea motlakase tse hlokang phetoho e phahameng.
